| 1. | In the five key factors of solder ball alloy , solder paste alloy , peak temperature , the time above liquidus and soldering environment , the fore four factors are more important than soldering environment to the solder joints reliability
在焊球合金、焊料合金、峰值温度、液相线以上时间和焊接环境五个关键因素中，前四项对焊点可靠性比较重要，焊接环境对焊点可靠性的影响不很显著。 |
